|ALCPI||High current inductance||Application Guide|
|ALDRH||◆ Low DC resistance and for large current. ◆ Closed magnetic circuit crosstalk. ◆ Excellent solderability and heat resistance. ◆ Available for automatic mounting in tape and real package.||Application Guide|
|ALDRI||◆ Low profile very effective in space-applications.
◆ High energy storage and very low resistance.
◆ Packed in embossed carrier tape and can be used by automatic mounting machine.
|AMPI||1. Metallization on ferrite core results in excellent shock resistance and damage-free durability. 2. Closed magnetic circuit design reduces leakage flux and Electro Magnetic Interference (EMI). 3. Fe base metal material core provides large saturation c||Application Guide|
|NR||1. he inductor designed as surface mounting , smallest and thinnest with high power ， high saturation and low resistance 2.Magnetic-resin shielded structure reduces buzz noise to ultra-||Application Guide|
|CDRH-R||1. High current and inductance capacity. 2. Specially designed for surface mounting. equipment, good for high density application. 3. Low profile very effective in space-conscious applicatior 4. Low resistance and high-energy storage.||Application Guide|
|CDRH-D||1. Large permissible DC current and low DC resistance. 2. Compact and thin. 3. Low cost and packed in embossed carrier tape.||Application Guide|
|CDRH73-129||1. High current and inductance capacity. 2.Specially designed for surface mounting. equipment, good for high density application. 3.Low profile very effective in space-conscious applications. 4.Low resistance and high-energy storage.||Application Guide|
|CD||High saturation current Magnetic shielded SMT type, suitable for reflow solding.||Application Guide|
|ALDB||1. High current and inductance capacity. 2.Specially designed for surface mounting. equipment, good for high density application. 3.Low profile very effective in space-conscious applications. 4.Low resistance and high-energy storage.||Application Guide|
|MCP||◆ High saturation current realized by material properties and structure design. ◆ Low DC resistance to achieve high conversion efficiency and lower temperature rising. ◆ Magnetically shielded structure to accomplish high resolution in EMC protection.||Application Guide|
|AMDP||• Frequency up to 3 MHz • 125℃ maximum total temperature operation • Low core loss • Ultra low buzz noise due to molding construction||Application Guide|