Home >> Products >> Inductor >> Power Inductors >> Wire Wound Molding >> MCP Series, Wire Wound Molding Power Inductors
FEATURES:
● Alloy iron powder material core provides large saturation current.
● Low DCR to achieve high conversion efficiency.
● Molding construction reduces buzz noise to ultra-low levels.
● Closed magnetic circuit design reduces leakage flux and EMI.
● Miniaturization and excellent temperature characteristics.
● Operating temperature:-40℃ ~ +125℃.
APPLICATIONS:
● Smart phone, Pad.
● Notebooks, VR, AR.
● Portable gaming devices, Smart wear, Wi-Fi module.
| Series | Size（mm） | Inductance(uH) | DCR(mΩ) | IDC(A) |
| MCP201610 | 2.0*1.6*1.0Max | 0.10~10 | 12~580 | 8.0~0.7 |
| MCP252010 | 2.5*2.0*1.0Max | 0.22~22 | 12.5~1300 | 6.5~0.6 |
| MCP252012 | 2.5*2.0*1.2Max | 0.10~10 | 10~400 | 10.5-1.05 |
| MCP322512 | 3.2*2.5*1.2Max | 0.10~10 | 7~230 | 11~1.8 |
| MCP3020 | 3.0*3.0*20Max | 0.33~10 | 9~160 | 9.0~2.2 |
