Home >> Products >> Inductor >> Power Inductors >> Wire Wound Molding >> MCP Series, Wire Wound Molding Power Inductors
FEATURES:
● Alloy iron powder material core provides large saturation current.
● Low DCR to achieve high conversion efficiency.
● Molding construction reduces buzz noise to ultra-low levels.
● Closed magnetic circuit design reduces leakage flux and EMI.
● Miniaturization and excellent temperature characteristics.
● Operating temperature:-55℃ ~ +125℃.
APPLICATIONS:
● Smart phone, Pad.
● Notebooks, VR, AR.
● Portable gaming devices, Smart wear, Wi-Fi module.
| Series | Size（mm） | Inductance(uH) | DCR(mΩ) | IDC(A) |
| MCP160865 | 1.6*0.8*0.65Max | 0.22~0.47 | 43~82 | 3.5~2.0 |
| MCP160808 | 1.6*0.8*0.8Max | 0.22~4.7 | 40~700 | 3.0~0.8 |
| MCP201208 | 2.0*1.2*0.8Max | 0.11~4.7 | 12~325 | 6.5~1.5 |
| MCP201210 | 2.0*1.2*1.0Max | 0.10~10 | 13~660 | 7.0~1.0 |
| MCP201608 | 2.0*1.6*0.8Max | 0.22~10 | 19~800 | 5.9~0.9 |
| MCP201610 | 2.0*1.6*1.0Max | 0.10~10 | 12~580 | 8.0~0.7 |
| MCP252010 | 2.5*2.0*1.0Max | 0.22~2.2 | 17~1300 | 6.5~0.6 |
| MCP252012 | 2.5*2.0*1.2Max | 0.10~10 | 10~400 | 10.5-1.05 |
| MCP322510 | 3.2*2.5*1.0Max | 0.33~10 | 15~365 | 7.8~1.8 |
| MCP322512 | 3.2*2.5*1.2Max | 0.10~10 | 7~230 | 11~1.8 |
| MCP322520 | 3.2*2.5*2.0Max | 0.33~4.7 | 9~94 | 9.0~3.0 |
| MCP303012 | 3.0*3.0*1.2Max | 10~15 | 220~380 | 1.9~1.3 |
| MCP303018 | 3.0*3.0*1.8Max | 0.22~4.7 | 7~87 | 9.0~3.0 |
| MCP303020 | 3.0*3.0*20Max | 0.30~10 | 9~160 | 9.0~2.2 |
| MCP404010 | 4.1*4.1*1.0Max | 10 | 280 | 2.0 |
| MCP404012 | 4.1*4.1*1.2Max | 0.47~10 | 14~235 | 8.5~2.0 |
| MCP404020 | 4.1*4.1*2.0Max | 0.33~22 | 6~330 | 8.5~1.3 |
| MCP404030 | 4.1*4.1*3.0Max | 0.68~10 | 10~110 | 8.0~3.3 |
