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|ALDRH||◆ Low DC resistance and for large current. ◆ Closed magnetic circuit crosstalk. ◆ Excellent solderability and heat resistance. ◆ Available for automatic mounting in tape and real package.||Application Guide|
|ALDRI||◆ Low profile very effective in space-applications.
◆ High energy storage and very low resistance.
◆ Packed in embossed carrier tape and can be used by automatic mounting machine.
|AMPI||1. Metallization on ferrite core results in excellent shock resistance and damage-free durability. 2. Closed magnetic circuit design reduces leakage flux and Electro Magnetic Interference (EMI). 3. Fe base metal material core provides large saturation c||Application Guide|
|NR||1. he inductor designed as surface mounting , smallest and thinnest with high power ， high saturation and low resistance 2.Magnetic-resin shielded structure reduces buzz noise to ultra-||Application Guide|
|CDRH-R||1. High current and inductance capacity. 2. Specially designed for surface mounting. equipment, good for high density application. 3. Low profile very effective in space-conscious applicatior 4. Low resistance and high-energy storage.||Application Guide|
|CDRH-D||1. Large permissible DC current and low DC resistance. 2. Compact and thin. 3. Low cost and packed in embossed carrier tape.||Application Guide|
|CDRH73-129||1. High current and inductance capacity. 2.Specially designed for surface mounting. equipment, good for high density application. 3.Low profile very effective in space-conscious applications. 4.Low resistance and high-energy storage.||Application Guide|
|CD||High saturation current Magnetic shielded SMT type, suitable for reflow solding.||Application Guide|
|ALDB||1. High current and inductance capacity. 2.Specially designed for surface mounting. equipment, good for high density application. 3.Low profile very effective in space-conscious applications. 4.Low resistance and high-energy storage.||Application Guide|
As the demand for servers continues to grow to meet ever-increasing data processing requirements, reducing power consumption provides a major driver for the key performance issues facing server power supply designers. Energy efficiency is very important, but by no means the only design consideration that needs to be addressed when choosing the right High Current Power Inductors for a particular application.
Due to efficiency requirements mandated by regulations from governments around the world and the need to reduce the carbon footprint of their products, server power supply designers are under tremendous pressure to maximize efficiency. There is also a need to improve the efficiency of server power systems and reduce power losses for strictly competitive reasons.
Once the design is optimized, High Current Power Inductors are one of the components that can improve efficiency. In addition to the higher current, higher operating temperature, and higher frequency requirements required for higher efficiency, other important selection criteria for power inductors include:
Smaller size - reduces circuit layout area
Tighter tolerances - ensuring consistent circuit performance
Very low DC resistance (DCR) - improves power efficiency
Multi-Stage Integration - Reduces PCB Footprint and Component Count
DC Resistance (DCR)
Open Inductance (OCL)
Full Load Inductance (FLL)
Peak Saturation Current (Isat) vs. Temperature
Thermal effect current (Irms)
Magnetic saturation flux density in Gauss (Bsat)
Bp-p (Gaussian) K factor for iron loss determination
AC Resistance (ACR)
From the above, it is clear that optimizing the selection of high-current inductors requires evaluating a wide variety of physical and electrical variables. While all customers want higher efficiency and lower losses, all customers' applications are different. Thermal management, space constraints, and other aspects make optimal selection of power inductors a daunting task. For Aillen's inductor designers, fundamental to the process is the choice of core material.
The electronics industry's need for high efficiency and high power density in a smaller area is driving inductor suppliers to reduce the overall size of the high-current inductor form factor. To meet this need, factors affecting inductor design include:
higher switching frequency
better core material
higher operating frequency
Reduce iron loss
Wider operating temperature range
Although inductors are rarely used in current sensing applications, tight DCR tolerances are still a desired product feature. Tighter DCR and OCL tolerances provide designers with important advantages in ensuring circuit stability and consistent lot-to-lot performance in volume manufacturing. Achieving this level of precision is the result of a combination of factors:
Consistent Manufacturing Process
High-quality raw materials for cores and windings
Optimized Design for Manufacturing
Precision test system
For Aillen, the application-specific approach allows selecting the right inductor for each application. This may involve modifying existing designs to meet customer needs. While this is not uncommon in the inductor business, the differentiation occurs in the experience and expertise of the inductor suppliers.
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